Type I , Type II , Type III, Type IV, IPC6013, Mil- P-50884
and
IPC6012 Type I, II and III
• Finished Min.Line Width
• Internal .004”
• External .005”
• Finished Min. Spacing
• Internal .004”
• External .005”
• Min Drilled Hole Size .010”
• Max. Aspect Ratio 15:1
• Min. Design Annular Ring .006
• Max. Layer Count 32
• Max. Overall Thickness .225”
• Sheet Size 18x24 standard (up to
24x30)
• Double Treat Foil
• Min Dielectric (Flex) .0005
• Min. Dielectric (Rigid) .003
• Laser UV & CO2
• Skiving
• Profiling (+/-.002”) +/- .001”
• Drill See Micro Vias
• Buried Vias (.008” hole)
• Blind Vias (sequential lamination) (.010”
hole) .008”
• Sequential lamination 3 laminations
• Via Fill
• Silver Epoxy (CB100)
• Resin Fill
• Impedance
• Pulse Plating
• Flying Probe ET
• Component Assembly (Thru hole & SMT, BGA,
ESD, Conformal Coat)
• In-Circuit Test (Gen Rad) Flying
Probe
• Environmental Test HASS and
HALT
• Chassis Build
• Ink Jet Printer Legend
• Final Finishes HASL, ENIG and Alloy gold
• Engineering Software Implemented
“Genesis” Software ODB++ automation
• Certifications AS9100, IPC6013,
IPC6012, MIL-P-50884, J-STD-001
• 3 dimensional X-Ray
• XRT Drill/X-Ray system
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